Tabletop Liquid Dispenser
Hernon Manufacturing’s (www.hernonmfg.com) Autobonder 2101 tabletop liquid dispenser is designed for low-volume production and repair applications. Capable of dispensing a variety of materials, including various adhesives and sealants (anaerobics, cyanoacrylates, silicones, and epoxies), along with oils, greases, solder fluxes, and paste lubricants. Uses a fully-grounded foot pedal, integrated pressure gauge and syringe for simple, accurate application.
High Feed Chamfer Mill
BIG Kaiser Precision Tooling’s (www.bigkaiser.com) C-Cutter Mini ultra-high feed chamfer mill delivers multi-function cutting, including chamfer-ing, back chamfering and face milling capabilities up to a 45o chamfering type with a 0.394-in. square insert. Available in single and 4-insert designs, the C-Cutter Mini achieves improved cutting efficiency, higher feed rates and increased spindle speed.
Servo Assembly Press Modules
Cincinnati Test Systems (www.cincinnati-test.com) develops a com-plete line of electromechanical servo assembly press modules—APM Standard and APMH Compact—with improved precision, reliability and control. Utilizing CTS’s SAM 300 Signature Analysis Module for operation control, the modules can accommodate push or pull operation and cover a range of force from 225 to 90,000 lb-/ft. with strokes from 5.1- to 15.75-in. and repeatability rates better than 0.01 mm.
High-Performance Laser Cutting
Mitsubishi Laser’s (www.mitsubishi-world.com) NX Series feature high-speed resonators available in 4,000- and 6,000-W sizes; complete with Mitsubishi’s 700 Series 64-bit, PC-based, 15-in. touch-screen display control system for improved accuracy and ability to produce complex parts. The patented 3-axis, cross-flow resonator design provides higher cutting power per watt and eliminates the need for quartz tubes and turbine blower systems, resulting in reduced maintenance costs. NX allows for acceleration up to 4 Gs or more and cutting stability at speeds of up to 1,150-in. per minute across all processing areas.